Abstract: Quasi-synchronous lasers, owing to their infinitesimal spot sizes and remarkably elevated energy intensities, possess extensive application in the precise local heating of particular devices, which can effectively preclude potential damage to the components that might otherwise result from wholesale heating. Thus, within the framework of devising novel temperature gradients, the integration of quasi-synchronous lasers emerges as a pivotal research in the discipline of integrated circuit fabrication. In this paper, taking the solder ball morphology yielded by the quasi-synchronous laser ball-mounting technique and the adhesion strength exceeding 20 MPa between the solder ball and the substrate as the decisive assessment criteria, the influences of laser wattage, defocus distance, scanning pathway, jump postponement and single-point irradiation time on the ball-mounting outcome are meticulously analyzed. The parameters are systematically summarized and optimized and an advanced laser ball-mounting technology has been achieved characterized by good homogeneity, flawless surface finish, excellent wetting characteristics with respect to the pads and substantial shear resistance. This research has pioneered the exploration of the quasi-synchronous laser ball-mounting process technology. The concept of controllable matrix-type ultrafast soldering process parameters is introduced for the first time. Simultaneously, the ball-mounting efficiency has been doubled. On average, it takes merely about 0.18 s per ball. Compared with the conventional laser jet ball-mounting method, which typically requires around 0.5 s per ball, the efficiency has been increased by 300%, thereby endowing the advanced packaging domain with a valuable technological reserve for multi-level packaging applications.