Abstract: The topological flow channel structure has the structural characteristics of bifurcation and convergence, which are beneficial for improving the convective heat transfer coefficient. In this paper a topology optimization method is used to design a topological channel structure for heat dissipation of array electronic devices. Compared with conventional microchannels, topological channel structure can directly transport cooling fluids along different channel paths to the corresponding heat sources, with advantages such as good temperature uniformity and low pressure drop. A manifold-jet-microchannel composite liquid cooling heat dissipation structure for array devices is designed based on topology optimization structural characteristics, and the heat dissipation performance is experimentally studied. The results indicate that under the condition of a flow rate of 1.27 L/min, a heat dissipation capacity of 1 221.6 W/cm² can be achieved. The topology optimization design method provides an effective technical approach for thermal management of electronic devices.