Abstract: With the rapid advancement of automotive intelligence and autonomous driving technologies, the computing power needed for automotive high-performance computer chips is increasing exponentially. In the future, the computing power of L4/L5-level autonomous driving chips will surpass 1000 TOPS. Nonetheless, greater computing power will inevitably result in significant power consumption and heat dissipation issues. Furthermore, the lightweight design of electric vehicles brings about restricted heat dissipation capacity, necessitating that the heat dissipation system withstands extreme conditions of elevated temperature, high altitude, and severe cold, in addition to intricate vehicle-grade vibration conditions. Consequently, packaging thermal management technology emerges as a principal problem in the creation of high-performance computing chips for the electric vehicle sector. This article examines current thermal management solutions for automotive high-performance computing chips from a packaging standpoint, focusing on the principles, performance, and applicable scenarios of microchannel cooling and microchannel vapor chamber technology. It serves as a reference for the thermal management of electric vehicles’ high-performance computing chips.