Abstract: 　　
　　In this paper, a heat transfer model of a satellite circuit board was established, and the temperature field under preliminary design conditions was simulated using ANSYS. An optimization design was conducted for the heat dissipation of high-power overheating components on PCB boards based on thermal resistance theory. Conductive copper strips directly connected to the casing were employed to reduce component temperature. By comparing the temperatures of high-power components before and after optimization, it was concluded that the conductive copper strips effectively lowered the temperature of the components.