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    基于拓扑-响应面协同的电子设备壳体轻量化设计与研究

    Lightweight design and research of electronic device housing based on topology response surface collaboration

    • 摘要: 针对弹上电子设备结构壳体轻量化需求,提出一种拓扑优化与响应面优化的协同设计方法。基于冲击响应谱构建壳体动力学载荷模型,采用变密度法开展以质量最小化为目标、刚度和体积分数为约束的拓扑优化,实现质量降低28.1%;针对拓扑优化后支耳应力集中问题,结合拉丁超立方实验设计建立Kriging代理模型,通过多目标遗传算法优化支耳连接处壁厚、支耳高度、圆角半径等参数,最终使壳体质量较初始设计降低21.1%,最大等效应力下降0.38%(从171.45 MPa降至170.79 MPa),满足安全系数≥1.5的工程要求。该方法为冲击载荷下弹载设备轻量化设计提供了高精度、高效率解决方案。

       

      Abstract: To address the lightweight design requirements of missile-borne electronic equipment structural housings, this study proposes an integrated design methodology combining topology optimization and response surface optimization. A dynamic load model of the housing was established based on the shock response spectrum (SRS). Topology optimization using the variable density method was conducted with the objective of minimizing mass and constraints on structural stiffness, achieving a 28.1% mass reduction. To resolve stress concentration issues at mounting lugs after topology optimization, a Kriging surrogate model was constructed through Latin Hypercube Sampling (LHS) experimental design, and key parameters—including lug wall thickness, height, and fillet radius—were optimized using a multi-objective genetic algorithm (MOGA). The final optimized design reduced the housing mass by 21.1% compared to the initial structure, decreased the maximum von Mises stress by 0.38% (from 171.45 MPa to 170.79 MPa), and satisfied the engineering safety factor requirement of ≥1.5. This methodology provides a high-precision and efficient solution for lightweight design of missile-borne equipment under shock loading conditions.

       

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