Abstract: This paper takes a certain electronic equipment chassis as the research object and uses the ICEPAK thermal simulation software to explore the influence of the open area ratio, position of the air inlet, and the air deflector at the air inlet on the performance of the fan and the heat dissipation of the chassis. The results show that, after the internal layout of the chassis and the model of the fan are determined, optimizing the open area ratio can adjust the working point of the fan and improve its working efficiency; changing the position of the air inlet can reconfigure the airflow organization inside the chassis and affect the heat dissipation of key components; adding an air deflector can guide the airflow and enhance the local wind speed and heat exchange. By comprehensively considering and coordinating the optimization of these three factors, the overall heat dissipation efficiency of the chassis can be significantly improved. This research can provide useful technical references and experience accumulation for the heat dissipation design of the chassis.