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    介质材料表面三维共形导电线路制造技术的研究进展

    A Review of Manufacturing Technology of 3D Conformal Electrically Conductive Circuits on the Surface of Dielectric Materials

    • 摘要: 介质材料具有质轻、价廉、良好的机械性能和化学稳定性等优点,已经在日常生活和工业领域得到了非常广泛的应用。在介质材料表面制造共形导电线路,实现电气功能和机械功能的一体化集成制造,不仅进一步拓展了介质材料的应用范围,而且非常有利于使电子产品向微型化、轻量化、高集成度、多功能化、低能耗等方向发展。本文综述了介质材料表面共形导电线路制造技术的研究进展,主要的制造技术包括柔性膜转移、光刻、喷墨打印、微笔直写、激光直接成型、激光活化金属化和转印技术,采用合适的制造工艺能够实现共形导电线路的高效制造。对比了各种共形导电线路制造技术的优缺点,并对共形导电线路的未来发展进行了展望。

       

      Abstract: Dielectric materials have been widely used in daily life and industrial fields because of their light weight, low cost, good mechanical properties and chemical stability. The fabrication of conformal electrically conductive circuit patterns on the surface of the dielectric materials can integrate mechanical and electrical functions, which not only further expands their application range, but also enables electronic products to develop in the directions of miniaturization, light weight, high integration, multi-functionality and low energy consumption. In this paper, the progress of the manufacturing technology of conformal electrically conductive circuit on the surface of dielectric materials was reviewed. The main manufacturing technologies included flexible membrane transfer, photolithography, inkjet printing, micro-pen direct writing, laser direct structuring, laser activation and metallization and transfer technology. And efficient fabrication of conformal electrically conductive circuit could be realized by adopting appropriate manufacturing process. The advantages and disadvantages of various manufacturing technologies for conformal electrically conductive circuit were compared, and the future development of conformal electrically conductive circuit was also prospected.

       

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