Abstract: With the rapid advancement of automotive intelligence and autonomous driving technologies, the computing power needed for automotive high-performance computing chips is increasing exponentially. In the future, the computing power of L4/L5-level autonomous driving chips will surpass 1000×10¹² operations per second. Nonetheless, greater computing power will inevitably result in significant power consumption and heat dissipation issues. Furthermore, the lightweight design of electric automobile brings about restricted heat dissipation capacity, necessitating that the heat dissipation system withstands extreme conditions of elevated temperature, high altitude, and severe cold, in addition to intricate automotive-grade vibration conditions. Consequently, packaging thermal management technology emerges as a principal problem in the creation of high-performance computing chips for the electric automobile. An overview of current thermal management solutions for high-performance automotive computing chips is provided from the perspectives of efficient heat conduction and uniform heat dissipation, with a focus placed on the principles, performance, and applicable scenarios of microchannel cooling technology and microchannel-based uniform heating technology. It serves as a reference for the thermal management of electric automobiles’ high-performance computing chips.