Abstract: A bionic curved leaf vein microchannel heat sink (LV-MCHS) for thermal management of electronic chips facing high heat flux dissipation challenges is proposed in this paper under inspiration of the curved vein patterns of leaves. The effect of initially designed parameters (microchannel height h, side vein spacing ratio γ and side vein width ratio β) on the performance of the microchannel heat sink is analyzed by an orthogonal test. The multi-objective optimization is then conducted based on the non-dominated sorting genetic algorithm-Ⅱ (NSGA-Ⅱ) and an optimized NSGA-Ⅱ-MCHS structure is obtained. To further evaluate the performance of the microchannel heat sink, the heat sink is fabricated via selective laser melting (SLM) and an experiment platform is established for performance test. The numerical simulations and experimental results show that when Reynolds number Re is 524, the pump power consumption of NSGA-Ⅱ-MCHS is reduced by 12.3% and thermal resistance is reduced by 3.07%, compared with the unoptimized LV-MCHS. These results clearly demonstrate that the optimized microchannel heat sink offers significant advantages in reducing the average temperature on the channel surface and flow resistance.