Abstract: The structure of plant leaf veins in nature has evolved over billions of years, endowing them with excellent capabilities in heat transfer and fluid transport. A bionic curved leaf vein microchannel heat sink (LV-MCHS) for thermal management of electronic chips facing high heat flux challenges is proposed in this paper under inspiration of the curved vein patterns of leaves. The effect of initially designed parameters (microchannel height h, side vein spacing ratio γ and side vein width ratio β)on the performance of the microchannel heat sink is analyzed by an orthogonal experiment. The multi-objective optimization is then conducted based on the non-dominated sorting genetic algorithm II (NSGA-II) and an optimized NSGA-II-MCHS structure is obtained. To further evaluate the performance of the microchannel heat sink, the heat sink is fabricated via selective laser melting (SLM) and an experiment platform is established for performance test. The numerical simulations and experimental results shows that when Re (Reynolds number) is 524, the NSGA-II-MCHS reduces pump power consumption W_pp by 12.3% and thermal resistance R_th by 3.07%, compared with the unoptimized LV-MCHS. These results clearly demonstrate that the optimized MCHS offers significant advantages in reducing the average temperature on the channel surface and flow resistance.