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    Cu3Sn相厚度对Cu-Sn IMC接头剪切性能的影响研究

    A Study on Influence of Cu3Sn Phase Thickness on Shear Performance of Cu-Sn IMC Joint

    • 摘要: 文中研究了具有不同Cu3Sn相厚度的Cu-Sn金属间化合物(Intermetallic Compound, IMC)接头在无电流(0 A/cm2)作用和电流(3×102 A/cm2)作用下的剪切变形与断裂行为。结果表明:无论有无电流作用,接头的等效模量和剪切强度均随着Cu3Sn相厚度的增加而增加,最高剪切强度分别为89.1 MPa(0 A/cm2)和83.2 MPa(3×102 A/cm2);在电流作用下,接头的等效模量与剪切强度下降,且下降率随着Cu3Sn相厚度的增加而减小,说明Cu3Sn相比Cu6Sn5相具有更好的电流抗性;随着Cu3Sn相厚度的增加,无论有无电流作用,接头断裂位置均由Cu6Sn相逐渐向Cu6Sn5相与Cu3Sn相界面转移,并最终出现在Cu3Sn相体内,呈现脆性断裂特征。该研究成果为Cu-Sn IMC接头可靠性的准确评估提供了必要的数据支持与理论支撑。

       

      Abstract: The shear deformation and fracture behavior of Cu-Sn intermetallic compound (IMC) joints with different thicknesses of Cu3Sn phases without current (0 A/cm2) and with current (3×102 A/cm2) stressing are studied in this paper. The results show that: whether under current stressing or not, the equivalent modulus and shear strength of the joints increase with the increase of Cu3Sn phase thickness, and the maximum strength is 89.1 MPa (0 A/cm2) and 83.2 MPa (3×102 A/cm2) respectively; the equivalent modulus and shear strength of the joints decrease under current stressing, and the decrease rate decreases with the increase of Cu3Sn phase thickness, which indicates that Cu3Sn phase has better current resistance than Cu6Sn5 phase; with the increase of Cu3Sn phase thickness, the fracture (a brittle fracture) position of the joints gradually changes from Cu6Sn phase to the phase interface between Cu6Sn5 and Cu3Sn and finally in the Cu3Sn phase whether under current stressing or not. These research results provide necessary data support and theoretical support for the accurate evaluation of the reliability of Cu-Sn IMC joints.

       

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