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    SiCp/Al复合材料激光刻痕表面形貌及烧蚀机理研究

    A Study on Laser Grooving Surface Morphology and Ablation Mechanism of SiCp /Al Composites

    • 摘要: 碳化硅颗粒增强铝基(SiCp/Al)复合材料表面功能微观结构(如传感器布线槽等)的精密刻蚀,对避免额外装配工序、拓展多功能集成轻质部件的应用具有重要意义。文中以含SiC颗粒(体积分数为70%)的SiCp/Al材料为试验对象,研究不同激光刻痕加工工艺参数(功率和扫描间距)对材料的表面形貌(烧蚀区域占比、粗糙度、微观结构)的影响,并分析了激光刻痕前后成分信息的变化,揭示了该材料激光刻痕的烧蚀机理。研究结果表明,随着扫描间距的减小,材料表面粗糙度逐渐增大,轮廓算术平均偏差Ra由200 μm扫描间距试样的19.23 μm分别增加到150 μm扫描间距试样的25.21 μm和100 μm扫描间距试样的30.63 μm。激光刻痕烧蚀区域表面主要为Al2O3氧化层,上面散布着纳米级的SiC颗粒, 其主要原因是低熔点的Al合金基质在热膨胀和表面张力的双重作用下发生了反应。该研究为优化SiCp/Al复合材料表面激光刻痕加工工艺和掲示烧蚀机理提供了重要参考。

       

      Abstract: Precise grooving of functional microstructures on the surface of SiC particle reinforced aluminum matrix (SiCp/Al) composites (such as sensor wiring slots, etc.) is of great significance for avoiding additional assembly processes and expanding the application of multi-functional integrated lightweight components. In this paper, taking SiCp/Al composites containing SiC particles(its volume fraction is 70%)as the object, the effects of different laser grooving processing process parameters (power and scanning spacing) on the surface morphology (proportion of ablation area, roughness, microstructure) of the composites are studied, the composition information change before and after laser grooving is analyzed and the ablation mechanism of the composites is revealed. The research results show that as the scanning spacing decreases, the surface roughness of the material gradually increases, and the arithmetic mean deviation of the contour Ra increases from 19.23 μm of the sample with a scanning spacing of 200 μm to 25.21 μm of the sample with a scanning spacing of 150 μm and 30.63 μm of the sample with a scanning spacing of 100 μm respectively. The surface of the laser grooving ablation area is mainly an Al2O3 oxide layer with nanoscale SiC particles on it. The main reason is that the low-melting-point Al alloy matrix reacts due to the dual effects of thermal expansion and surface tension. This study provides an important reference for the process parameter optimization and the ablation mechanism study of the laser grooving of the SiCp/Al composites surface.

       

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