Abstract: As electronic devices continue to advance in performance, thermal design has emerged as a critical bottleneck in their development. A systematic overview of the current status and challenges in thermal design technologies for electronic devices is presented in this paper. It explores key technical directions, including heat conduction, heat convection, heat radiation, thermal energy storage and microsystem cooling, and provides insights into current technical approaches, research progress and future trends. The thermal design requirements of high-power, high-integration and high-reliability electronic devices are particularly focused on in this paper, and corresponding technology selection suggestions are provided, which can provide effective solutions to electronic device thermal management. Continuous innovation in thermal design technologies will provide crucial support for the efficient, reliable and safe operation of electronic devices.