Abstract: Low temperature co-fired ceramics (LTCC) possess outstanding dielectric properties, thermal stability and multi-functional integration capabilities, and have been widely applied in 5G/6G communications, millimeter-wave radars, satellite payloads and system-level packaging. However, traditional processes have two significant limitations: first, constrained by the forming methods, it's difficult to achieve high-precision fabrication of curved multi-layer substrates; second, the complex process flows and strong dependence on batch scale make it difficult to meet the rapid verification requirment for single-piece and small-batch substrates. Additive manufacturing, based on the unique technical path of layer-by-layer stacking and on-demand deposition, provides an innovative solution to break through the above bottlenecks.In this paper, the research trends in material preparation and forming processes involved in LTCC additive manufacturing are systematically reviewed, the existing key issues are analyzed in depth, and the future development directions are prospected.