Abstract: With the increase of chip integration level and packaging density, the heat density generated in computer keeps increasing exponentially in recent years. To adapt to this situation, besides continuing the develop ment of various high-performance chip cooling technologies, deployment and optimization of computer thermal management from system-level, aiming to reduce power consumption and cooling costs, are becoming more and more necessary. In this article, a number of typical system-level thermal management technologies for personal computer and server are comprehensively reviewed. Some new viewpoints on cooling modality, material, structure and the utilization were presented. The key scientific issues are analyzed. Future prospects of developing advanced computer cooling technology are suggested.