机载电子设备BGA封装热设计

Thermal Design of BGA Package for Avionics

摘要: 由于表贴器件制造公差的影响,器件与冷板间的接触热阻无法有效控制。器件上方直接安装散热冷板的方法不能满足大热耗BGA封装器件的散热要求。介绍一种"活塞"式导热组件,充分考虑了上述因素,有效控制了器件与冷板间热阻。经过理论计算和实验验证,能够满足较大热耗器件在密封机载电子设备内的散热要求。
- 接触热阻 /
- BGA /
- “活塞”式导热组件 /
- 机载电子设备
Abstract: Because of the influences of such factors as machining tolerance etc., the contact thermal resistance between chip and cold plate can't be controlled effectively. The method of installing a cold plate on the chip surface can't meet the cooling requirements to high power BGA chip. In this paper, a so called "PISTON" thermal conduction module which fully considers these factors is introduced. By thermal performance calculation and test, it is shown that this structure can meet the chip's cooling requirements to sealed avionics.
- contact thermal resistance /
- BGA /
- "PISTON" thermal conduction module /
- avionics

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