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    高精度微波印制电路工艺技术研究

    Research on High Precision Microwave Printed Circuit Technology

    • 摘要: 随着微波印制电路产品向着体积小、重量轻、可靠性高和高密度互连(High Density Interconnection,HDI)的趋势发展,其制造能力特别是高精度的制造工艺水平急需提升。文中简单介绍了微波印制电路对基材的要求,重点讨论了高精细线条、高精密对位及高精度外形铣切等关键工艺,分别通过螺旋面天线、耦合器和开关电路基片等典型样件的制造与测试,验证了工艺的可行性。结果显示,该工艺技术不仅可提高现有产品的微波性能,也为未来毫米波产品的发展奠定了一定的工艺基础。

       

      Abstract: With the development trend of microwave printed circuit (MPC) products towards small volume, light weight, high reliability and high density interconnection (HDI), it is urgent to advance its manufacturing capability, especially the high precision MPC technology. The material requirements of MPC are simply introduced and the crucial technology of high precision line, high precision alignment and high precision milling are mainly discussed. Samples of spiral antenna, coupler and switch are made and tested to validate the feasibility of technology. The result shows that the high precision MPC technology can not only improve the microwave performance of the existing products, but also make a foundation for development of millimeter wave products.

       

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