多层微波印制板制造工艺及装联技术研究

Study on Manufacturing and Assembly Technologies of Multilayer Microwave Printed Circuit Board

摘要: 使用CLTEXT微波基板、fastRise28和CuClad6700粘结片，重点研究了多层微波印制板制造工艺中多层化压制、数控钻孔、孔壁钻污处理、孔金属化活化处理等关键工艺，实现了陶瓷粉填充聚四氟乙烯介质多层印制板的制造。此外，对多层微波印制板后续电子装联技术进行了探讨。本项研究结果表明，选用合适的粘结片材料，能够实现聚四氟乙烯树脂体系基板材料的多层化制造。

Abstract: Using CLTE-XT microwave substrate, fastRise-28 and CuClad6700 bonding sheets. Key techniques in multilayer microwave printed circuit board (PCB) manufacturing such as multilayer press, CNC drilling, drilling sewage processing of hole wall, hole metallization activation are mainly studied. The manufacturing of ceramic powder filled PTFE dielectric multilayer microwave PCB is realized. The technology of successive assembly of the multilayer microwave PCB is also investigated. According to the results of this study, by choosing proper bonding sheet material, the multilayer manufacturing of the PTFE resin system substrate can be achieved.