Abstract: SiC_p/Al composite material has low conductivity and low expansivity, especially has no brazing ability. In order to obtain good brazing performance of packaging case, gold-plating modification treatment for its surface is essential. Gold-plating technology is studied in this paper for the SiC_p/Al composite with more than 60% SiC volume fraction. The major objective is solving the binding force difficulty between gold coating and substrate. Through process experiment, steps of electroless nickel plating, heat treatment, nickel electroplating and gold electroplating are adopted. Coating thus obtained is smooth and flat, and no obvious nodulation and inclusion are found. Its binding force with substrate is strong. As one of the surface treatment technology for SiC_p/Al weldability, the process has important reference value for the surface treatment of other aluminum matrix composites.