Abstract: A new method of ENEPEG surface treatment is presented which is used for production of microwave LTCC substrate with silver conductor. Experiments on different green tapes and silver pastes show that ENEPEG surface treatment is feasible and reliable for special green tape and silver paste. The depth of every layer of ENEPEG is optimized with gold wire bonding force. The research shows that ENEPEG surface on silver conductor LTCC substrate has good wire bonding ability, solderability and solderelaching resistance; the metal film reliability is even better than gold paste LTCC substrate; the substrate′s reliability, adaptability for worse environment and electric performances are compatible with microwave module production engineering application. The new method provides an effective alternate route for low cost production of microwave LTCC substrate.