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    密闭电子设备机箱的热设计试验研究

    Experimental Study on Thermal Design of Sealed Electronic Enclosure

    • 摘要: 针对某雷达密闭电子设备机箱长期运行出现温度过高现象,研究了影响机箱内部模块散热的因素。采用温度试验进行逐步测试,并用理论计算及Icepak软件对该散热模型进行仿真分析。基于试验测试和数值仿真分析相结合的方法,通过降低传导热阻和提高传热能力解决机箱散热问题。环境试验结果验证了方法有效,保证了密闭电子设备机箱在高温条件下正常工作,满足了设计要求。

       

      Abstract: To solve the overheat problem of a sealed electronic enclosure of radar in long-time operating, the factors influencing its heat dissipation of inner modules are investigated. Temperature experiments are conducted, and then theoretical calculation and numerical simulation using Icepak software are completed. Based on experimental measurement and numerical simulation, the overheat problem is solved by decreasing the thermal conduction resistance and improving the heat transfer capability. Environment test results verify the validity of the proposed method which ensures the normal operation of the enclosure in high temperature and meets the design requirements.

       

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