Abstract: With the development of electronic and information technology, the performance of the electronic packaging material is becoming even more critical. The metal matrix composites (MMCs) is an ideal electronic packaging material for its excellent thermal physical properties such as light weight, high thermal conductivity, low expansion coefficient. The MMCs is designed with high volume fraction of reinforcement for electronic packaging, which makes its manufacturing and application very difficult. In this paper the research status and application of the MMCs are summarized and the key problems in application are pointed out. The solutions to these problems are also suggested.