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    Ku波段多路大功率放大器热设计

    Thermal Design of Ku-band Multiplex High Power Microwave Amplifier

    • 摘要: 功率放大器是雷达、通信、导航等信号发射系统的重要部件之一,随着其大功率、小型化、集成化、高可靠性要求的提高,大功率放大器的散热性能成为制约其进一步发展的重要因素。文中基于CFD热仿真软件Flotherm对某Ku波段多路大功率放大器进行热设计,讨论了传热学的基本理论,进行了系统散热方案设计以及放大器腔体结构热设计,优化了散热器结构尺寸。最终在35 ℃环境温度下,对放大器进行稳态热仿真,得到了功率放大芯片的温度以及散热风扇的风速,仿真结果表明,该设计满足系统的热设计要求。

       

      Abstract: Microwave amplifier is one of the key components of signal generator system used in radar, communication, navigation and so on. With greater requirements for high power, miniaturization, integration and reliability, the thermal performance of high power amplifier gradually becomes a main factor limiting its further developments. Based on CFD software Flotherm, thermal design of a Ku-band multiplex high power microwave amplifier are carried out in this paper. Basic theories of heat transfer are discussed. Cooling system design of the amplifier and thermal structure design of its cavity are carried out. The structure and size of the heat sink is optimized at last. Eventually, steady thermal analysis of the amplifier is carried out at the ambient temperature of 35 ℃, the temperature of amplifier chips and the air flow speed of cooling fans are obtained, it reveals that the thermal design of this amplifier satisfies its thermal requirements.

       

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