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    国产粉末冶金硅铝合金的封装性能研究

    Packaging Capabilities of Homemade Si/Al Alloy by Powder-metallurgy Processing

    • 摘要: 硅铝合金材料以其优异的综合性能,在微波组件封装中得到越来越广泛的应用。为了推动硅铝封装材料的国产化,文中采用粉末冶金方法制备了系列成分的硅铝合金材料,并对其加工性能、镀涂性能和激光密封性能进行了研究。结果表明,国产粉末冶金硅铝材料的物理性能满足电子封装轻量化、高导热的应用需求,其加工性能、镀涂性能和激光焊接性能也可满足气密封装要求,具备工程化应用的潜力。

       

      Abstract: Si/Al material has been more and more widely used in packaging of microwave modules for its excellent capabilities. To popularize the homemade Si/Al alloy, the powder-metallurgy (P/M) technique has been used to fabricate Si/Al alloy with series components and the capabilities of Si/Al alloy, such as post-processing, plating and laser hermetic welding are studied in this paper. The result shows that the physical performance of the homemade Si/Al alloy by powder-metallurgy processing meets the requirements of electronic packaging with light weight and high thermal conductivity and its processing, plating and laser hermetic welding performances also satisfy the hermetic packaging requirements,which proves the industrial application potential of the powder-metallurgy processed Si/Al alloy.

       

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