Abstract: The micro-resistance welding technology is widely used in the manufacturing of electronics and mechanical equipment for it's mature and simple and convenient to operate. In this paper this technology is innovatively applied to the interconnection of the microwave modules such as the T/R module. The process and method of the micro-resistance welding in the microwave multichip modules are first analyzed. Then by means of this process the interconnection can be realized between the low-frequency connectors and its metal substrate, between different microwave circuits or the inner circuits on the RF connector joint. This process and technology can overcome the rigorous limits of surface weldability. The results show that the welding qualities of the metal wire and ribbon (the copper wire plated with gold, gold ribbon and copper foil plated with gold) in the high frequency and RF circuits are reliable.