Abstract: In order to solve the problem of high density of sheet plate and high heat consumption of single plate, an efficient cooling is needed. Sometimes traditional passive cooling methods, i. g. wind cooling, liquid cooling, can not solve the problem lonely, but other active cooling methods like air conditioning are also needed . To solve the problems air condition faced , such as heat imbalance , too high partial heat flux density in electronic equipment chassis, an integrated high efficient cooling chassis is designed using thermoelectric cooling technology. This design is proved to fesible by simulation and experiment. It provides an innovative design choice for the future chassis cooling.