Abstract: In order to investigate the cause of rivet fracture for an electronic equipment, a full-scale finite element model is established, and load conditions are achieved based on quantitative analysis on fracture surface. Then, the fracture position of the rivet is predicted accurately by numerical simulation, the rivet fracture process and the fatigue life are given. It is shown that the too large assembly stress and the vibration load from the carrier together cause the rivet fatigue failure.