Abstract: This paper focuses on the laser soldering technique for the hermetic packaging of the tile microwave module. The process parameters which influence the formation of the soldering joint, such as soldering structure, the temperature of the heating stage, soldering flux, defocus amount, laser power and soldering rate, are optimized. The microstructure of the laser soldering joint is analyzed. The hermeticity of the module is measured. The results show that while the temperature field during the process of the hermtic packaging using the laser soldering is dynamically changed, the laser power and soldering rate should change dynamically within limits by program design. The solder fills in the gap between the shell and lid. No void and crack is observed in the joint, while no solder is observed within the shell. The solder wets well on the Ni plating layer. No coarse brittle Au-Sn intermetallic compound forms in the interface between the solder and the shell or lid. The microstructure of the solder remains eutectic(Sn)+(Pb) near the surface of the joint. A thin AuSn and AuSn₂ intermetallic compound layer forms between the Ni-P plating layer and the solder near the internal surface of the joint. The hermticity of the module sealed using optimized laser soldering process meets the requirement of the active antenna array.