Abstract: As a new type of highly effective heat dissipation device, the aluminous vapor chamber has the advantages of light weight , small volume and good temperature uniformity , and thus has a good application prospect in embedded computers . In this paper a comparative study of the heat dissipation performances of the aluminous vapor chamber, heat pipe heat sink and aluminum alloy heat sink under different work conditions is carried out based on the domestic processor board widely used in embedded computers. The test results show that for the single domestic processor board, the heat pipe heat sink has the best heat dissipation performance,the heat dissipation performance of the aluminous vapor chamber is slightly worse, but they both have great advantages over the aluminum alloy heat sink.