Abstract: The thermal conductivity of solid-liquid phase change materials is very low, so they often can not melt completely in a specified time to absorb the heat load of electronic equipment, which leads to local over-temperature. The high thermal conductivity heat storage device is studied in this article by numerical simulation and experimental methods. The integrated design of vapor chamber and heat storage device is adopted. The vapor chamber converts point heat source into surface heat source, eliminating the problem of local over-temperature caused by the temperature peak of electronic products, and increasing the heat absorption area of phase-change materials. At the same time, aluminum alloy plate and aluminum alloy corrugated plate are added into the phase change material. Through these designs, the equivalent thermal conductivity of paraffin is increased, the amount of paraffin melting in a short time is increased and the heat storage capacity is improved.