Abstract: As the use of high-power devices becomes more and more popular, the problems of high single-point heat consumption and high heat flux density have become more prominent. In the past, liquid cooling is used to solve this problem. But compared with air cooling, liquid cooling has the disadvantages such as a lot of equipment and high cost. This article discusses the use of air cooling for dealing with the coexistence of high heat consumption and high heat flux density, so that air cooling can be applied in high heat consumption and high heat flux projects. Through simulation analysis, the vapor chamber (VC) uniform temperature plate is adopted and the structural parameter optimization of air-cooled cold plate is carried out to reduce each thermal resistance on the heat transfer path. Thus, an air-cooled cold plate that meets the heat dissipation requirement is obtained. The physical test after installation proves the feasibility of air cooling in solving the problem of high heat consumption and high heat flux density.