Abstract: With the development of radio frequency (RF) electronic equipment towards high integration and high power, the traditional open cycle cooling technology can’t meet the requirements of system miniaturization and high heat flux. A closed-cycle on-chip cooling technology must be developed. The micropump is the core component of the closed cooling system, while the performance of the current microfluidic pumps differs from the requirements of high flow and high lift in RF microsystems by an order of magnitude. Therefore, it is urgent to clarify the development direction of micropumps and develop micropumps with good performance in order to solve the bottleneck of heat dissipation and break the barriers of performance improvement of the RF microsystem.