Abstract: With the development of satellite electronic equipment towards integration, miniaturization, light weight and fast maintainability, the application of blind-mating technology to modules is more and more widespread. Aiming at the assembly quality problems of high density blind-mating for modules in the satellite antenna system, this paper discusses the assembly structure and the influencing factors of the assembly accuracy of blind-mating. According to the analysis results, an in-situ measuring device and a crimping assembly device for blind-mating are developed. The devices realize the in-situ measurement for the axial spacing of the blindmating. The gap dimensions between the modules are precisely controlled by the in-situ measuring device, the positioning and the orientation between the modules are ensured by the crimping assembly device. Finally, the assembly tests are carried out on the active modules of a satellite antenna system, and the result proves the effectiveness of the proposed assembly technology.