Abstract: Based on the development requirement of miniaturized spaceborne radio frequency (RF) module, an integrative soldering process is presented by comprehensively utilizing the technical advantages of microassembly process and surface mounting technology. Highly reliable integration of system in package (SiP) devices, multi-layer radio frequency board, RF insulators, metal cavity and double side mounting devices is accomplished through ceramic packaging with high lead attached ball, printed circuit board/cavity soldering and low-void vacuum vapor-phase soldering. The product performance test, environmental test and process qualification test show that this process method has outstanding advantages in production cycle, assembly efficiency, first pass rate, performance consistency and long-term reliability.