Abstract: The heat dissipation power of NVIDIA JETSON TX2 high-power system chips is generally around 25 W. The heat dissipation method of combining a fan and a finned heat sink has the problems of large volume, high height and inconvenient integration into small system. The combination of heat pipe, fan and copper fin radiator has the advantages of low height, small volume and high heat transfer efficiency. First, the structure design of the heat pipe module is carried out. Then, the rationality of the design is calculated and verified. ANSYS Icepak is used to conduct thermal steady-state simulation for the heat pipe module. It is found that the temperatures of the main chips are all within the required range, which verifies the rationality of the design. Finally, the heat pipe module is installed into the system for temperature test. The results indicate that the temperature results of the main chips obtained from calculation, simulation and experiment are basically consistent.