Abstract: In order to meet the high-performance and high-reliability application requirements of independent and controllable domestic chips, a reinforced liquid cooling module based on immersion liquid cooling technology is designed and realized. All components are immersed in the cooling liquid of the module, and through reasonable structural layout, the flow of cooling liquid is forced to accelerate the removal of heat generated by each chip in the module, which effectively solves the problems of high power density, local overheating of devices and low energy utilization rate in a limited space, and improves the overall cooling efficiency and space utilization rate of the computer. Finally, the liquid cooling module is successfully trial-produced, filled with cooling liquid and met the requirements of the project. It can provide a reference to promote the application of immersion cooling technology in the field of reinforced computers in the future.