Abstract: With the increasing integration of electronic devices, the requirement for packaging materials with high thermal conductivity has been growing. Diamond-reinforced metal matrix composites have become a research focus due to their excellent thermal conductivity. However, the challenge lies in the poor wettability between diamond particles and the metal matrix, which makes it difficult to fabricate the diamond-reinforced metal matrix composites with high thermal conductivity. An overview of the research progress in diamond-reinforced metal matrix composites is presented in this paper, including interface modification, optimization of process parameters and composite material fabrication methods. And the current problems and future research directions of diamond-reinforced metal matrix composites are discussed.