Abstract: With the rapid development of electronic technology，superpower and high power density devices are widely developed and applied．But there is a problem about how to cool these superpower devices reasonably and effectively to improve their reliability．The cooling technique for the electronic equipment is mainly discussed in this paper．First，the design principle of the cooling system and the selection of the cooling mode and the coolant are introduced．Then a detailed description on the design of the air-cooling system and the liquid-cooling system commonly used is given．And the problems in the design are analyzed in detail．Finally，the application of the simulation，experiment on the thermal design of the electronic equipment is introduced in this paper．And the application of some new thermal conductive materials is prospected at the end of the paper．