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    新型镉银高强度低温焊料的研究与应用

    Research and Applicaiton of New Type High Strength Low-temperature Cadmium Silver Solder

    • 摘要: 在电子设备馈线系统的精密焊接领域,长期存在的难点是寻求到一种高焊缝强度与低焊接温度兼容的焊料。文中针对可在400 ℃以下焊接并实现高强度的焊料展开深入的研究与分析。经反复试验与优化筛选,以Cd占72%、Zn占19%、Ag占7%、Cu占2%的重量比作为该焊料的成份,利用相匹配的焊剂,采取特殊的熔炼工艺技术,满足了馈源喇叭精密焊接技术要求。经长期使用证实,该焊料具有焊接温度低、焊缝强度高、焊缝质量好、浸润与流动性好、焊缝镀银性能优异等特点。

       

      Abstract: In the precise welding field of electronic equipment feeder system, it′s difficult to find a solder with high strength compatible with low welding temperature. In this paper a high strength solder which can be welded below 400 ℃ is analyzed in detail. After repeated tests and optimization, the matching solder is obtained with the weight ratio of 72% for Cd , 19% for Zn ,7% for Ag and 2% for Cu. Proper flux and special smelting technology are adopted to meet the requirements. Practice shows the solder is characterized by low welding temperature, high strength, good quality, good infiltration, good liquidity and good silver coating performance etc.

       

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