Abstract: Gold-tin (20Sn/80Au) eutectic is the interconnecting material for common power devices because of its high thermal conductivity, but the high operation temperature often damages GaAs power amplifier. So in this paper, a novel fabrication technique is used to bond a power amplifier to heat sink using the adhesive with high thermal and electrical conductivity. Compared to Au/Sn welding material (300 ℃), this kind of adhesive, with the same cooling effect as Au/Sn welding material, has lower operation temperature (200 ℃). The relationship between the void ratio and solidification parameter, the effect of environment test on the die shear strength are also studied. The results show that this adhesive bonding technique can be used in the manufacturing of power modules with high reliability.