Abstract: The research of the BGA soldering-ball process is carried out for reusing the BGA devices. By using the BGA soldering-ball technology, the production costs can be reduced and the production schedule can be protected. Theory analysis determines four key factors of BGA soldering-ball quality: soldering-ball way, flux, soldering-ball steel and reflow profile. A series of comparison process experiments are carried out for these four factors, the optimal process parameters of the factors are determined and the improved BGA soldering-ball process is established. Performance tests for resoldering-ball BGA show that those resoldering-ball BGA work properly and stably in secondary use, so the BGA soldering-ball process is proved to be feasible and can be effectively applied to the BGA rework.