Al-50%Si合金封装壳体与LTCC基板的热匹配试验

Experiment of Thermal Matching between Al-50%Si Alloy Package Shell and LTCC Substrate

摘要: 对Al-50%Si合金封装壳体与LTCC基板进行了钎焊，测试了焊后以及温度冲击试验后壳体的平面度，并对LTCC基板焊接开裂和电信号通断进行了检测。热膨胀匹配性试验结果表明，Al-50%Si合金封装壳体与LTCC基板的热匹配性较好，在钎焊面积达到71 mm × 60 mm时未出现裂纹。Al-50%Si合金是一种具有广阔应用前景的封装材料。

Abstract: Soldering is carried out between Al-50%Si alloy package shell and LTCC substrate. The flatness of the shell after soldering and experiment of temperature impact is tested, and the welding crack and the electrical signal of the substrate are detected. Thermal matching experiment results indicate good thermal matching between Al-50%Si alloy package shell and LTCC substrate. There is no cracking in LTCC substrate when the soldering area is up to 71 mm × 60 mm. Al-50%Si alloy as a packaging material has wide application prospects.