Abstract: This paper presents the fundamental principles, thermal performance and application analysis of a thermal management method based on thermoelectric cooling. Taking a certain solid power amplifying unit as a design example, the temperature data are obtained about power amplifying chips of the traditional air cooling device and after the thermoelectric cooling slice is inserted by the numerical simulation and experiment. At the same time, it is found that changing the voltage of the cooling slice has an effect on the cooling effect through comparison and analysis. The results show that the box bottom temperature of the heat source module drops more than 10 ℃ after the thermoelectric cooling slice is inserted. It's demonstrated that the thermoelectric cooling slice has good heat dissipation performance.