Abstract: In order to improve the heat dissipation, the performance analysis and structure optimization of the heat sinks on the PCB board of the household appliances are carried out in this paper, based on the thermal analysis of the multi-fin heat sinks, the heat dissipation of two kinds of two-dimensional porous material heat sinks is analyzed, and the heat dissipation property of the three kinds of heat sinks is compared. The research shows that the heat dissipation property of two-dimensional porous material is better than multi-fin heat sinks under forced air cooling conditions; the heat dissipation property of the hexagon porous heat sinks is better than the rectangular, at the same time, it is more beneficial to realize the lightweight requirement of the structure, reduce the material cost and improve the profit of the product.