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    数字阵列模块壳体电子束封焊数值模拟及优化

    Numerical Simulation and Optimization of Digital Array Module Shell during Electron Beam Welding

    • 摘要: 采用组合热源模型描述了焊接能量分布,对数字阵列模块壳体的电子束封焊过程进行数值模拟,并同实际试验结果进行对比验证。在此基础上,对4种不同搭接形式及工艺参数进行仿真优化。结果表明,四周台阶0.6 mm宽的搭接形式不仅可以获得足够的熔深,而且焊缝根部到台阶边缘的距离短,可以避免后续腐蚀风险,为推荐的结构形式。采用高的热输入,利于获得宽的焊缝,利于填充台阶间隙。

       

      Abstract: The method of combined heat source is adopted to describe the welding energy distribution. The electron beam welding process of the digital array module shell is numerically simulated and is compared with experimental results. On this basis, four different lapping forms and the process parameters are optimized. The results show that the lapping form of 0.6 mm width four-side steps can obtain enough melting depth, and the distance from the root of the weldjoint to the edge of the step is small. The risk of subsequent corrosion can be avoided. It is a preferential structural form. The use of high heat input is beneficial to obtain wide weldjoint and to fill the gaps of the steps.

       

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