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    某大功率铝硅合金模块多场耦合仿真与设计优化

    Multi-field Coupling Simulation and Optimization of a High-power Al-Si Alloy Module

    • 摘要: 铝硅合金封装壳体在雷达行业中应用越来越广泛,封装壳体的可靠性要求也越来越高,特别是在微波功率模块设计时,除机械应力外,热应力也是不可忽视的影响因素。文中以某大功率封装壳体为例,通过热–结构多物理场耦合仿真,瞬态计算高功率输出情况下的铝硅壳体支耳的应力分布,从而识别支耳存在的失效风险,并进行实验验证。仿真结果与实验结果一致。采用正交实验法优化支耳结构,使其满足设计及使用需求,对后续工程应用具有较大的指导意义。

       

      Abstract: The Al-Si alloy shell has wider and wider application in radar industry, and the reliability of the shell is required to be higher and higher. Especially in the design of microwave power module, besides mechanical stress, thermal stress is also an unignorable factor. In this paper, a high-power package shell is taken as an example to carried out the transient calculation of the stress distribution of the lug of the Al-Si shell under the condition of high power output by the thermal-structural multi-field coupling simulation to identify the failure risk of the lug. Experiments are also carried out. The simulation results are consistent with the experimental results. The lug structure is optimized by the orthogonal experiment method to meet the application and design requirements, which has a good guiding significance for subsequent engineering application.

       

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