Abstract: As the key components of active phased array, the cost of T/R modules is the highest in the whole antenna array. Therefore, how to reduce the cost of T/R modules is an important problem which should be considered at the design stage. Compared with low temperature co-fired ceramic multilayer substrate, which is commonly used for multichip T/R module, multilayer printed circuit board has a huge cost advantage. In this paper, a Ku-band low cost four-channel transceiver is developed by using a hybrid-laminated multilayer printed circuit board, combined with an aluminum alloy package housing. This transceiver can achieve 6-bit phase shift and 6-bit amplitude attenuation. Its receiving channel gain is greater than or equal to 20 dB and its output power of transmitting channel is greater than or equal to 10 W. For the problems of high thermal expansion coefficient, low wiring density and poor wire bonding reliability, the substrate stacking scheme is optimized and the key process technologies such as high-density interconnection through hole fabrication, highly reliable bonding of surface plating and low cost hermetic packaging have been researched, which can effectively improve the reliability of the products. This research can provide a reference for the engineering application of low-cost hybrid-laminated multilayer printed circuit boards in multi-chip module packaging.