Abstract: Conductive adhesives are widely used for devices assembly such as chips in micro-assembly and electronic packaging field, which can meet the requirements of high density and high reliability integration. Effects of rosin bleeding out in conductive adhesive on wire bonding strength on the surface of substrates are studied, which is evaluated by destructive test of wire bonding. The relationship between rosin bleeding out and substrate condition, curing parameters are researched in detail and bleeding-out controlling methods, such as conductive adhesives parameters optimization, vacuum curing and anti-diffusion agent treatment are explored. The test results indicate that anti-diffusion agent treatment and vacuum curing under 100 ℃ for 2 hours is one of the effective bleeding-out suppression methods.