Micro-assembly Technologies for Satellite-borne Microwave Module
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Graphical Abstract
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Abstract
Satellite-borne microwave modules are the core components of space-based synthetic aperture radar (SAR), which are assembled compactly by many components. According to the micro-assembly technical requirements of high precision, high consistency and high reliability for the satellite-borne microwave modules of space-based SAR, this paper carries out the research of micro-assembly technology of the modules, focusing on the key technologies such as low voidage chip soldering, low outgassing rate chip bonding, high reliability wire bonding, radiation protection design and low moisture content hermetic packaging. The satellite-borne microwave module with high precision, high consistency and high reliability is successfully developed, which meets the relevant technical requirements of a space-based SAR. This research establishes the technical foundation for the development of satellite-borne microwave module with high precision, high consistency and high reliability.
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