Soldering-resistant Technology in Large Area Soldering of Microwave Module

Focusing on the critical issue of solder overflow during large area soldering process of microwave modules, the wetting behavior in large area soldering process is discussed in this paper. The implementation of soldering-resistant technologies is discussed systematically from the perspective of reducing the wettability between molten solder and base materials. Typical soldering-resistant techniques are introduced, including solder mask, high-temperature resistant materials, and incompatible alloy masking, while the advantages, disadvantages, and applicability of which are analyzed. The manufacturability and soldering-resistant effects of three representative processes, namely water-soluble solder mask, silicone rubber pad, and laser-deposited soldering-resistant, are compared to explore their applications in large area soldering of microwave modules. Results show that by selecting appropriate soldering-resistant technologies based on specific application scenarios, effective control of solder overflow is achieved, thus enhances the assembly reliability of microwave modules.