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    Research on Accelerated Aging Test and Lifetime Prediction of LED Headlamp Modules under Temperature-Humidity Condition
    ZHAO Hongbo, ZENG Fantao, LU Liwei, HOU Guiqi, LU Lingyun, ZHANG Xiaoqing, JIANG Yejie, YUAN Wei, TANG Yong
    2025, 41(6): 1-8. DOI: 10.19659/j.issn.1008–5300.20251125001
    Abstract PDF
    A Study on Fabrication and Performance of an Ultra-thin Vapor Chamber with Vapor-liquid Compound Channel
    TANG Heng, ZHANG Ruibo, CHEN Xuhong, AN Kang, SUN Peng, HUANG Junxin, TANG Yong
    2025, 41(6): 9-16, 39. DOI: 10.19659/j.issn.1008–5300.20251009108
    Abstract PDF
    Heat Dissipation Challenge and Research Progress of Automotive High-performance Computing Chip
    LI Jingyan, WANG Qing, ZHENG Huai, GUAN Penghui, XIE Xianli
    2025, 41(6): 17-23. DOI: 10.19659/j.issn.1008–5300.20250325023
    Abstract PDF
    Fractal Study on Effective Thermal Conductivity of Rough Dual-porosity Media
    ZOU Haoqian, XIAO Boqi, YANG Shanshan, WANG Huili, GUO Xiuya, ZHENG Qian
    2025, 41(6): 24-32. DOI: 10.19659/j.issn.1008–5300.20250324020
    Abstract PDF
    Research on Heat Dissipation Technology for Spaceborne Computers Based on Graphite-Aluminum Composites
    LEI Le, LI Qingyue, LIANG Xinxin, LEI Bing
    2025, 41(6): 33-39. DOI: 10.19659/j.issn.1008–5300.20250611062
    Abstract PDF
    Experimental Study on Leaf Vein Microchannel Heat Sink Based on NSGA-Ⅱ Optimization Design
    ZHONG Xin, YANG Guangzhao, ZHANG Qifeng, CAO Mingxuan, YANG Liang, GUO Weiwei
    2025, 41(6): 40-47, 53. DOI: 10.19659/j.issn.1008–5300.20250520047
    Abstract PDF
    A Study on Thermal Design for Optical Module Interconnected System Based on Air Cooling
    YANG Mingdong, WU Huipeng, YANG Yuxiang, LUO Yong
    2025, 41(6): 48-53. DOI: 10.19659/j.issn.1008–5300.20250418030
    Abstract PDF
    Thermal Characteristics and Optimization Design of Circuit Board for Aerospace Application
    LI Hanqing, FENG Zhengwu, GAI Dongxing, CHEN Chen
    2025, 41(6): 54-59. DOI: 10.19659/j.issn.1008–5300.20250408028
    Abstract PDF
    Research on Application of Diamond/Cu Heat Dissipation Material in Transmitter/Receiver Module
    ZHANG Mi, WANG Congxiang, LI Hao, WANG Yuefei, WANG Qing, NIU Tong
    2025, 41(6): 60-64. DOI: 10.19659/j.issn.1008–5300.20250609062
    Abstract PDF
    Thermal Design Analysis of High Power Microwave Processing Unit
    YANG Ningning, HU Guangtao, TIAN Ying, LI Qi, LIU Guowei, MEI Junxiu
    2025, 41(6): 65-70. DOI: 10.19659/j.issn.1008–5300.20250302008
    Abstract PDF
    Research Progress of Collaborative Robot Arm Control Strategy Optimization Based on Digital Twin
    DING Xiaoyue, CHEN Xiyu
    2025, 41(6): 71-80. DOI: 10.19659/j.issn.1008–5300.20250923060
    Abstract PDF